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Title:
基板収納容器
Document Type and Number:
Japanese Patent JP7423429
Kind Code:
B2
Abstract:
To provide a substrate housing container which can suppress flowing of dust into an upper part inside a container body together with air when a lid body is removed while observing standardized standard, does not need to change a shape or configuration of the container body in particular, and can expect improvement in quality of a substrate without considerably modifying a mold for the container body.SOLUTION: A substrate housing container includes: a container body 1 for housing a semiconductor wafer; a lid body 10 engaging a front surface 2 of the container body 1; and a windbreak member 20 housed in the container body 1. On both sides inside the container body 1, a plurality of support pieces 5 supporting the semiconductor wafer are provided opposite and arranged in a vertical direction. The windbreak member 20 is provided with: a windbreak plate 21 which is supported by the pair of support pieces 5 on an uppermost stage of the container body 1 and faces an internal upper surface of the container body 1; a wind shield wall 25 which is stood on a front end part of the windbreak plate 21 and suppresses flowing of particles into a gap between the internal upper surface and the windbreak plate 21 of the container body 1 together with the clean air when the lid body 10 is removed; and an engaging mechanism 26 engaging the windbreak plate 21 within the container body 1 by using elasticity.SELECTED DRAWING: Figure 2

Inventors:
Fumiya Homma
Application Number:
JP2020098782A
Publication Date:
January 29, 2024
Filing Date:
June 05, 2020
Export Citation:
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Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H01L21/673
Domestic Patent References:
JP2019029596A
JP2014513442A
JP2017092172A
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akishige Miyao
Nobuyuki Baba