Title:
A board thickness measuring device in a bending processing machine
Document Type and Number:
Japanese Patent JP5995488
Kind Code:
B2
Inventors:
Akira Nakamura
Tomohiro Yukida
Tomohiro Yukida
Application Number:
JP2012083537A
Publication Date:
September 21, 2016
Filing Date:
April 02, 2012
Export Citation:
Assignee:
Amada Holdings Co., Ltd.
International Classes:
B21D5/02
Domestic Patent References:
| JP2001205339A | ||||
| JP2030327A | ||||
| JP2001001051A | ||||
| JP2006088183A | ||||
| JP2001300640A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu