Title:
沸騰冷却装置
Document Type and Number:
Japanese Patent JP7185420
Kind Code:
B2
Abstract:
A boiling cooling device e includes a power semiconductor that is vertically disposed, heat radiating plates provided on both side faces of the power semiconductor, heat receiving jackets provided at both sides of the power semiconductor and covering the heat radiating plates, refrigerant filled in the heat receiving jackets and being in contact with the heat radiating plates, a condenser connected to the heat receiving jackets, and fine longitudinal grooves formed on a heat radiating face of the heat radiating plate and extending in a vertical direction, where creation of air bubbles is promoted by heat generated in the power semiconductor and by the fine longitudinal grooves, the created air bubbles rising and passing through a forward pipe and then reaching the condenser to be liquefied, such that liquid is returned to the heat receiving jacket via a return pipe.
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Inventors:
Michiaki Hiyoshi
Application Number:
JP2018099850A
Publication Date:
December 07, 2022
Filing Date:
May 24, 2018
Export Citation:
Assignee:
HYUNDAI MOTOR COMPANY
International Classes:
H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
| JP63019842A | ||||
| JP52065341A | ||||
| JP2011530195A | ||||
| JP2001345589A | ||||
| JP61109143U | ||||
| JP2001068611A | ||||
| JP61176141A |
Foreign References:
| US20110198059 | ||||
| WO2008090726A1 | ||||
| US20100012299 | ||||
| CN101589287A |
Attorney, Agent or Firm:
Patent Attorney Corporation Kyosei International Patent Office
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