Title:
等電位ボンディング金具
Document Type and Number:
Japanese Patent JP5226021
Kind Code:
B2
Inventors:
Toshihiro Watanabe
Kazunori Ishii
Hiroyuki Suzuki
Masaki Ezawa
Kazunori Ishii
Hiroyuki Suzuki
Masaki Ezawa
Application Number:
JP2010015588A
Publication Date:
July 03, 2013
Filing Date:
January 27, 2010
Export Citation:
Assignee:
Your Tech Co., Ltd.
Iwabuchi Corporation
Iwabuchi Corporation
International Classes:
H02G13/00; E04H9/14; H02G3/30
Domestic Patent References:
| JP2005032482A |
Attorney, Agent or Firm:
Go Eto
Shigeo Nakajima
Shigeo Nakajima