Title:
PLATABLE POLYOLEFIN RESIN MOLDING
Document Type and Number:
Japanese Patent JP3213371
Kind Code:
B2
Abstract:
PURPOSE: To provide a polyolefin resin molding which is platable, retains excellent physical properties even after plated, and gives a plated molding with electromagnetic shielding capability at a low cost.
CONSTITUTION: This molding is obtd. by treating the surface of a molding made from a resin compsn. with an acid. The compsn. comprises 50-90wt.% polyolefin resin, 10-30wt.% filler consisting of a fibrous magnesium oxysulfate having a diameter of 0. 1-2μm and a length of 2-6μm or calcium carbonate having a mean particle diameter of 0. 05-10μm, and up to 30wt.% inorg. platy or fibrous filler. A compsn. comprising 100 pts.wt. the above compsn. and 5-20 pts.wt. olefinic elastomer is used for obtaining the molding.
Inventors:
Manabu Nomura
Kaoru Wada
Kaoru Wada
Application Number:
JP10384292A
Publication Date:
October 02, 2001
Filing Date:
March 31, 1992
Export Citation:
Assignee:
Idemitsu Petrochemical Co., Ltd.
International Classes:
C08K3/26; C08K3/34; C08K7/00; C08K7/04; C08J7/14; C08K7/08; C08L23/00; (IPC1-7): C08J7/14; C08K3/26; C08K7/08; C08L23/00
Domestic Patent References:
| JP54116066A |
Attorney, Agent or Firm:
Agata Akira (1 person outside)