Title:
ガラス基板用緩衝体及び該緩衝体を用いた包装体
Document Type and Number:
Japanese Patent JP4149818
Kind Code:
B2
Abstract:
A buffer capable of integrally packaging multiple sheets of glass substrates having electronic components formed thereon, wherein a side wall (4) having a length of 30 to 100% ranging from the top to the end part of an L−shaped body (2) is formed on at least one side of the body (2) of L−shape in cross section by using an internal molded body formed with polyolefin resin foam particulates with specific physical properties, whereby the buffer can be used suitably for a packaging operation, particularly for automization, in a clean room, and also can be re−used.
Inventors:
Hamada Itsu
Toshio Yamazaki
Toshio Yamazaki
Application Number:
JP2002593259A
Publication Date:
September 17, 2008
Filing Date:
May 29, 2002
Export Citation:
Assignee:
Asahi Kasei Chemicals Corporation
International Classes:
B65D81/113; B65D57/00; B65D59/00; B65D85/86; C08J9/22; B65D85/48; C08L23/00
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi
Yoshihiro Yamaguchi