Title:
センタレス研削盤
Document Type and Number:
Japanese Patent JP7417281
Kind Code:
B2
Abstract:
To provide a centerless grinder which can automatically adjust a positional relationship between a grinding grindstone, and a blade and an adjusting grindstone without use of a pressing mechanism which presses a work-piece from above.SOLUTION: A centerless grinder comprises an adjusting grindstone 1, a grinding grindstone 2, a blade 4, a control unit 20, an external force sensor 8, a first actuator 41, and a second actuator 42. An adjusting grindstone drive mechanism 21 can rotate the adjusting grindstone 1 in a clockwise direction and a counterclockwise direction. Operation of the first actuator 41 or the second actuator 42 is controlled, a distance between a work-piece W and the grinding grindstone 2 is adjusted, and a contact point between of the grinding grindstone 2 and the work-piece W is detected. At the adjustment time, the adjusting grindstone 1 rotates in the counterclockwise direction opposite to a direction during processing, the grinding grindstone 2 and the work-piece W contact each other, and consequently, a force is applied to the work-piece W in a direction of the blade 4 by counteraction such that a torque of the work-piece W gives rotational motion in the counterclockwise direction to the grinding grindstone 2, and the external force sensor 8 detects the force.SELECTED DRAWING: Figure 1
Inventors:
Takaomi Abe
Satoshi Kobayashi
Satoshi Kobayashi
Application Number:
JP2021090603A
Publication Date:
January 18, 2024
Filing Date:
May 28, 2021
Export Citation:
Assignee:
Micron Precision Co., Ltd.
International Classes:
B24B5/18; B24B47/20; B24B49/10
Domestic Patent References:
| JP3103149U | ||||
| JP2019063891A | ||||
| JP6408512B2 |
Attorney, Agent or Firm:
Deloitte Tohmatsu Patent Attorneys Corporation