Title:
コイルとこれを備えた加熱部材及び半導体組立システム
Document Type and Number:
Japanese Patent JP5528063
Kind Code:
B2
Abstract:
PURPOSE: A coil is provided to increase processing speed by reducing the time consumed in the packaging process. CONSTITUTION: A coil(10301) comprises a first body(10320), a second body(10340) and a third body(10360). The first body and the second body have the same shape. The first main body has an upper part(10322) and a lower part(10324). The longitudinal direction of the upper part is generally positioned to be parallel with a first direction(62). The upper part has an inner area and an outer area. The lower part is protruded downward from the upper part in a third direction(66). The lower part has an area which is perpendicular in a third direction and smaller than the upper part. The lower part of the first body and the lower part of the second body face each other.
Inventors:
Lee Kwang
Money people
Lee
Hong Zhi
Satoru Ken
Money people
Lee
Hong Zhi
Satoru Ken
Application Number:
JP2009257601A
Publication Date:
June 25, 2014
Filing Date:
November 11, 2009
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H05B6/36; B23K1/00; B23K1/002; F27D11/06; H01L21/60; H05K3/34; B23K101/42
Domestic Patent References:
| JP57155694U | ||||
| JP2000260815A | ||||
| JP2005150142A | ||||
| JP200736110A | ||||
| JP2003148873A | ||||
| JP8236529A | ||||
| JP9097973A | ||||
| JP2007142343A | ||||
| JP2001257458A |
Attorney, Agent or Firm:
Kyosei International Patent Office