Title:
複合センサ
Document Type and Number:
Japanese Patent JP7381530
Kind Code:
B2
Abstract:
Provided is a combine sensor (1) including a pressure sensor module (10) as a pressure detector, a thermistor unit (20) as a temperature detector, a housing portion (30) housing the temperature detector closer to a flow path (101) than the pressure detector. The temperature detector includes a thermistor case (25) where a first lead (26) and a second lead (27) connected to a thermistor are partially embedded. The thermistor case (25) includes an extension part (25a) and a ring part (25b) including a flow hole part (25c). The thermistor (21) is supported by the extension part (25a) to be arranged outside an opening end (30g). The extension part (25a) is provided by being separated into a portion where the first lead (26) is embedded and a portion where the second lead (27) is embedded, along an extending direction of the extension part (25a), and includes a space portion (S) communicating with the flow hole part (25c) and the outside.
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| JP6128002 | Pressure sensor |
| WO/2021/037489 | PRESSURE SENSOR |
| WO/2009/119349 | PRESSURE SENSOR PACKAGE |
Inventors:
Daichi Muramoto
Shingo Nomoto
Shingo Nomoto
Application Number:
JP2021144463A
Publication Date:
November 15, 2023
Filing Date:
September 06, 2021
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
G01L19/14; G01K7/22
Domestic Patent References:
| JP2004226325A | ||||
| JP202067349A | ||||
| JP2011202960A | ||||
| JP20192875A |
Foreign References:
| US20200072685 | ||||
| KR102006750B1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu