Title:
A compound, a thermosetting resin composition, and a thermosetting sheet
Document Type and Number:
Japanese Patent JP6166988
Kind Code:
B2
Inventors:
Ken Nishio
Application Number:
JP2013182307A
Publication Date:
July 19, 2017
Filing Date:
September 03, 2013
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C08G59/70; C07C53/134; C07C53/18; C07C61/135; C07C63/08; C07C381/12; C08K5/36; C08L63/00; C08L71/12
Domestic Patent References:
| JP2004269713A | ||||
| JP2010205498A | ||||
| JP2002003581A |
Other References:
ネットワークポリマー,2012年,Vol.33,No.6,329-334
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda