Title:
導電性組成物
Document Type and Number:
Japanese Patent JP7276052
Kind Code:
B2
Abstract:
To provide a conductive composition which can be used as a wiring formation material excellent in conductivity and a joint material of a substrate and an electronic component, has a long pot life until the electronic component is mounted after having been coated to the substrate, and hardly causes variations in joint strengths.SOLUTION: A conductive composition contains 0.1-2 mass% of a compound represented by the following formula (1), 0.1-4 mass% of an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, 60-94.8 mass% of conductive particles and 5-40 mass% of a binder resin. In formula (1), R1 is a hydrogen atom or a methyl group.SELECTED DRAWING: None
Inventors:
Kazuhiro Kubota
Yasunori Tagami
Yasunori Tagami
Application Number:
JP2019179168A
Publication Date:
May 18, 2023
Filing Date:
September 30, 2019
Export Citation:
Assignee:
NOF CORPORATION
International Classes:
H01B1/22
Domestic Patent References:
| JP2002033018A | ||||
| JP2017186605A |
Attorney, Agent or Firm:
Keikei Yoneda