Title:
A conductive element, a manufacturing method for the same, a wiring device, and original recording
Document Type and Number:
Japanese Patent JP6032280
Kind Code:
B2
Abstract:
A conductive element includes: a substrate having a first wavy surface, a second wavy surface, and a third wavy surface; a first layer provided on the first wavy surface; and a second layer formed on the second wavy surface. The first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: 0≰(Am1/λm1)<(Am2/λm2)<(Am3/λm3)≰1.8 (where Am1 is an average width of vibrations of the first wavy surface, Am2 is an average width of vibrations of the second wavy surface, Am3 is an average width of vibrations of the third wavy surface, λm1 is an average wavelength of the first wavy surface, λm2 is an average wavelength of the second wavy surface, and λm3 is an average wavelength of the third wavy surface.)
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Inventors:
Kazuya Hayashibe
Hiroshi Tazawa
Kajitani Shunichi
Hiroshi Tazawa
Kajitani Shunichi
Application Number:
JP2014507683A
Publication Date:
November 24, 2016
Filing Date:
March 08, 2013
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01B5/14; G06F3/041; H01B13/00; H05K1/02; H05K3/00
Domestic Patent References:
| JP2012204170A | ||||
| JP2011230431A |
Foreign References:
| WO2011027909A1 | ||||
| WO2011080890A1 |
Attorney, Agent or Firm:
Masatomo Sugiura
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