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Title:
A conductive polyacetal resin constituent and its forming object
Document Type and Number:
Japanese Patent JP6054811
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyacetal resin composition which is excellent in conductivity and toughness, little contaminates a metallic mold in long-term continuous molding, and the conductivity of which little changes even when the polyacetal resin composition is stored for a long period of time in a melted state and then is injection-molded.SOLUTION: There is provided the polyacetal resin composition which contains at least a polyacetal resin (I), carbon black (II), and an epoxy compound (III). A content of the carbon black (II) is 5-30 pts.mass based on 100 pts.mass of the polyacetal resin (I). The polyacetal resin composition has a volume resistivity of 10to 10Ω cm and a nominal tensile strain at break of 15% or more, and both of amounts Aand Aof formaldehyde generation measured by a specific method are 100 ppm/min or less.

Inventors:
Inagaki Nozomi
Takaaki Miyoshi
Application Number:
JP2013117295A
Publication Date:
December 27, 2016
Filing Date:
June 03, 2013
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L59/00; C08K3/04; C08K5/1515; C08L63/00
Domestic Patent References:
JP5890848B2
JP3296557A
JP2012236905A
JP63210161A
JP2009155480A
JP2006299154A
JP2010285539A
JP2009269996A
JP2006348265A
JP2004010803A
JP63213549A
Foreign References:
US2998409
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito



 
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