Title:
接続装置
Document Type and Number:
Japanese Patent JP7453955
Kind Code:
B2
Abstract:
A connecting device may be provided comprising a positive connecting element and a negative connecting element, wherein the positive connecting element has an elevation arranged on a base surface and the negative connecting element has a depression introduced into a contact surface, into which the elevation of the positive connecting element can be introduced, wherein the positive and the negative connecting element may be connected to one another by rotation relative to one another.
Inventors:
Beck Jochen
Beck Marc
Beck Marc
Application Number:
JP2021500340A
Publication Date:
March 21, 2024
Filing Date:
March 19, 2019
Export Citation:
Assignee:
Beck GmbH
International Classes:
B24B45/00; B23B31/02; B23B31/113; B24B23/02
Domestic Patent References:
| JP2007054933A | ||||
| JP3204925U | ||||
| JP4079051U | ||||
| JP11099460A |
Foreign References:
| EP1795301A1 | ||||
| US20170252899 |
Attorney, Agent or Firm:
Cleo International Law & Patent Office