Title:
CONNECTOR ASSEMBLY
Document Type and Number:
Japanese Patent JP2023086974
Kind Code:
A
Abstract:
To provide a stacked wire-mounted wafer connector and a connector assembly that can achieve a reduction in the number of components and miniaturization, as well as to improve the workability of insertion and removal.SOLUTION: A stacked wire-mounted wafer connector includes a latch portion 25 integrally formed in a wafer 40 and extending along a second side 46a of the wafer 40, at least one protrusion 47b extending outwardly along the Z-axis direction of the wafer 40 from a first base 47 of the wafer, and at least one opening into which the protrusion 47b of another stacked wire-mounted wafer connector 20 is inserted. By the protrusion 47b of the other stacked wire-mounted wafer connector 20 being inserted into the opening of the stacked wire-mounted wafer connector 20, misalignment of a mating connector between the stacked wire-mounted wafer connector 20 and the other stacked wire-mounted wafer connector 20 in the mating direction (X-axis direction) is suppressed.SELECTED DRAWING: Figure 5
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Inventors:
HAYASHI TATSUYA
NAITO MASATO
NAITO MASATO
Application Number:
JP2023074776A
Publication Date:
June 22, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO
International Classes:
H01R13/514; H01R12/71; H01R13/64
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda Adult
Yoshinori Shimizu
Junichiro Sakamaki
Yumoto Joji
Ikeda Adult
Yoshinori Shimizu
Junichiro Sakamaki
Yumoto Joji