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Title:
A constituent for applied type BPSG film formation, a substrate, and a pattern formation method
Document Type and Number:
Japanese Patent JP6250514
Kind Code:
B2
Abstract:
A composition for forming a coating type BPSG film, containing one or more silicic acid skeletal structures represented by formula (1), one or more phosphoric acid skeletal structures represented by formula (2), one or more boric acid skeletal structures represented by formula (3), and one or more silicon skeletal structures represented by formula (4), wherein the composition contains a coupling between units in formula (4). The composition is capable of forming a BPSG film that has excellent adhesiveness in fine patterning, can be easily wet etched by a removing liquid which does not cause damage to a semiconductor substrate and a coating type organic film or a CVD film mainly consisting of carbon which is required in the patterning process, can maintain the peelability even after dry etching, and can suppress generation of particles by forming it in the coating process.

Inventors:
Seiichiro Tachibana
Yoshinori Taneda
Kikuchi Rie
Tsutomu Ogiwara
Application Number:
JP2014204545A
Publication Date:
December 20, 2017
Filing Date:
October 03, 2014
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09D183/04; C08G77/48; C08G77/56; C08G79/00; C09D7/12; C09D183/05; C09D183/06; C09D183/08; C09D183/14; G03F7/09; G03F7/11; G03F7/16; G03F7/26; H01L21/027
Domestic Patent References:
JP64049037A
JP2008052203A
JP2006023706A
JP2006139083A
JP2013137512A
JP55034258A
JP55034276A
Attorney, Agent or Firm:
Mikio Yoshimiya