Title:
A constituent and the photolithography method containing a sugar ingredient
Document Type and Number:
Japanese Patent JP6144005
Kind Code:
B2
Abstract:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that have sugar substitution. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
Inventors:
Jun Suk Oh
Dayan Wang
Kon Ryu
Minki Lee
Chun Yi Woo
Chen-By Sue
Dayan Wang
Kon Ryu
Minki Lee
Chun Yi Woo
Chen-By Sue
Application Number:
JP2011249149A
Publication Date:
June 07, 2017
Filing Date:
November 14, 2011
Export Citation:
Assignee:
Rohm and Haas Electronic Materials LLC
International Classes:
G03F7/039; C08F220/26
Domestic Patent References:
| JP2005308827A | ||||
| JP2007304537A | ||||
| JP2010250075A | ||||
| JP2008268915A | ||||
| JP2005037777A | ||||
| JP2011053360A | ||||
| JP2011213840A | ||||
| JP2007304545A | ||||
| JP2011053430A |
Foreign References:
| WO2010067898A1 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office