Title:
POLISHING COMPOSITION AND PRODUCING METHOD THEREOF AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2016069535
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing composition which can polish polishing objects such as element silicon, silicon compounds and metals, especially a polishing object containing tungsten at high polishing rate.SOLUTION: A polishing composition contains colloidal silica having organic acid stabilized on the surface, hydrogen peroxide and a salt, in which the salt is at least one of ammonium nitrate and ammonium sulfate. Sulfonic acid, sulfinic acid, or phosphonic acid is used as the organic acid.SELECTED DRAWING: None
Inventors:
SATO TSUYOKI
SAKABE KOICHI
SAKABE KOICHI
Application Number:
JP2014200720A
Publication Date:
May 09, 2016
Filing Date:
September 30, 2014
Export Citation:
Assignee:
FUJIMI INC
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2013138053A | 2013-07-11 |
Foreign References:
| WO1998054756A1 | 1998-12-03 | |||
| US20050258139A1 | 2005-11-24 |
Attorney, Agent or Firm:
Tetsuya Mori
Suzuki Isobe
Hide Tanaka Tetsu
Yuki Yamada
Suzuki Isobe
Hide Tanaka Tetsu
Yuki Yamada
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