Title:
冷却装置及びその製造プロセス
Document Type and Number:
Japanese Patent JP2004518269
Kind Code:
A
Abstract:
The cooling device, particularly for electronic components, such as microprocessors, consists of a substrate ( 1 ), which features a heat-inlet surface that is in thermal contact with an object ( 6 ) to be cooled and a heat-dissipation surface. The heat-dissipation surface has a defined structure, preferably in the form of continuous channels ( 2 ), and has a significantly larger surface area than the heat-inlet surface. At least the heat-inlet surface, but preferably also all or significant portions of the heat-dissipation surface are provided with a thin coating ( 3 ) made of heat-conductive material. Another improvement is obtained because the surface features a coating made of fine particles ( 21 ), e.g., made of metal or metal oxide, which further increases the surface area.
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Inventors:
Hoffman Wilfried
Application Number:
JP2002521358A
Publication Date:
June 17, 2004
Filing Date:
August 07, 2001
Export Citation:
Assignee:
NF Nano Filter Technique GM BHA
International Classes:
H01L23/36; F28F13/00; H01L23/367; (IPC1-7): H01L23/36
Attorney, Agent or Firm:
Akihiro Ryuka