Title:
COPPER FOIL WITH CARRIER FOIL, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE FOR LASER PERFORATION OBTAINED USING THE COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
Japanese Patent JP2017160540
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve processing performance of laser perforation of a copper-clad laminate, in which a blacking processed surface is used as a laser perforation processing surface.SOLUTION: In order to solve the above problem, in a copper foil with carrier foil 1 provided with a layer structure of carrier foil 2/peel layer 3/bulk copper layer 4, between the peel layer 3 and the bulk copper layer 4, metal component-containing particles 5 are provided, the metal component-containing particles 5 are made present such that in a viewing field of 5 μm×4 μm, a coverage (A) occupies the range of 7.4 area%≤A≤34 area%.SELECTED DRAWING: Figure 1
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Inventors:
YOSHIKAWA KAZUHIRO
Application Number:
JP2017078963A
Publication Date:
September 14, 2017
Filing Date:
April 12, 2017
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D1/04; B32B5/16; B32B7/06; B32B15/20; C25D5/10; C25D5/16; C25D5/48; C25D7/06; H05K1/09
Domestic Patent References:
| JP2001308477A | 2001-11-02 | |||
| JP2001068816A | 2001-03-16 | |||
| JPS6199596A | 1986-05-17 |
Foreign References:
| WO2002024444A1 | 2002-03-28 | |||
| WO2005079130A1 | 2005-08-25 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura