Title:
A method for manufacturing a copper foil with a carrier foil and a copper foil with a carrier foil, and a copper-clad laminate for laser drilling obtained by using the copper foil with a carrier foil.
Document Type and Number:
Japanese Patent JP6346556
Kind Code:
B2
Abstract:
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.
Inventors:
Yoshikawa Kazuhiro
Application Number:
JP2014502328A
Publication Date:
June 20, 2018
Filing Date:
February 27, 2013
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D1/04; C23C28/00; C25D7/06
Domestic Patent References:
| JP2001140090A | ||||
| JP2001308477A | ||||
| JP200168816A |
Foreign References:
| WO2002024444A1 | ||||
| WO2005079130A1 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura
Hiroko Negishi
Hiroko Negishi
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