Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP7403448
Kind Code:
B2
Abstract:
Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents -CO-, -S-, or -SO2-, and Y represents -S-, -SO2-, -O-, -CO-, -COO-, or -CONH-. n represents an integer of 0 or greater.
Inventors:
Daisuke Ito
Tsukasa Yoshida
Toshihiro Tai
Hitomi Tamaki
Satoshi Kakumoto
Tsukasa Yoshida
Toshihiro Tai
Hitomi Tamaki
Satoshi Kakumoto
Application Number:
JP2020525554A
Publication Date:
December 22, 2023
Filing Date:
June 10, 2019
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C08L71/10; B32B27/00; C08G65/48; C09D171/10; C09J171/10
Domestic Patent References:
| JP2003213130A | ||||
| JP2000248252A | ||||
| JP2001323067A |
Foreign References:
| WO2017169738A1 | ||||
| US7897715 |
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical