Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP7404105
Kind Code:
B2
Abstract:
To provide a curable composition capable of giving a cured product which exhibits high thixotropy and suppresses the reduction of an elastic modulus under a high temperature.SOLUTION: There is provided a multi-component curable composition which comprises: A agent containing a polyoxyalkylene-based polymer (A) having a reactive silicon group represented by formula (1), a (meth)acrylic ester-based polymer (B) having a reactive silicon group represented by the formula (1) and an epoxy resin curing agent (D) having a tertiary amine; and B agent containing an epoxy resin (C). The epoxy resin (C) includes a bisphenol A type epoxy resin (C1) and an aminophenol type epoxy resin and/or a naphthalene type epoxy resin (C2), either or both of A agent and B agent contain fumed silica (E). -SiR5cX3-c (1) (wherein, R5 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X represents a hydroxyl group or a hydrolyzable group, c represents 0 or 1.)SELECTED DRAWING: None
Inventors:
Kiyoshi Miyafuji
Application Number:
JP2020031249A
Publication Date:
December 25, 2023
Filing Date:
February 27, 2020
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G59/68; C08L71/02; C08G65/336; C08K3/36; C08L33/04; C08L63/00; C09J133/04; C09J163/02; C09J171/02
Domestic Patent References:
| JP2018165359A | ||||
| JP2007191633A | ||||
| JP2011016985A | ||||
| JP2011526960A |
Foreign References:
| WO2019163804A1 |
Attorney, Agent or Firm:
Ariko Patent Office