Title:
A curing device and a curing method of a building
Document Type and Number:
Japanese Patent JP6055616
Kind Code:
B2
Inventors:
Atsuhiro Doyama
Mizushima Yoshito
Hideo Ono
Masanori Sato
Tetsuya Minamihara
Takeshi Asano
Naoki Nishita
Hideo Yoshii
Mizushima Yoshito
Hideo Ono
Masanori Sato
Tetsuya Minamihara
Takeshi Asano
Naoki Nishita
Hideo Yoshii
Application Number:
JP2012120075A
Publication Date:
December 27, 2016
Filing Date:
May 25, 2012
Export Citation:
Assignee:
Obayashi Corporation
Sansei Kenki Co., Ltd.
Sansei Kenki Co., Ltd.
International Classes:
E04G21/32
Domestic Patent References:
| JP2004068412A | ||||
| JP7317304A | ||||
| JP10331431A |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation