Title:
CUTTING DEVICE AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2017148882
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method that are capable of reducing the influence of imaging a cutting trace on manufacturing lead time.SOLUTION: An imaging device 90L includes a part of a virtual straight line represented by Y=-(k×Yp) (k is integer satisfying k≥0) on the existence plane of a workpiece 10 in an imaging field of view, in which the Y direction position of a cutting blade 23 is Y-0, the relative cut indexing feeding direction of a spindle unit 20 with respect to a θ table 40 is +Y direction, and a cut indexing pitch is Yp. When the workpiece 10 is moved in an X direction in a cutting step, a cutting trace formed in the cutting step is imaged by the imaging device 90L.SELECTED DRAWING: Figure 1
Inventors:
MATSUOKA DAISUKE
KAGAWA SHINICHI
SADACHI TATSUO
KAGAWA SHINICHI
SADACHI TATSUO
Application Number:
JP2016031351A
Publication Date:
August 31, 2017
Filing Date:
February 22, 2016
Export Citation:
Assignee:
TDK CORP
International Classes:
B24B49/12; B24B27/06; B24B49/04; H01L21/301
Domestic Patent References:
| JP2016009751A | 2016-01-18 | |||
| JP2008262983A | 2008-10-30 | |||
| JP2011240476A | 2011-12-01 | |||
| JP2001298000A | 2001-10-26 |
Attorney, Agent or Firm:
Takashi Murai
Hiromi Murai
Hiromi Murai
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