Title:
切削装置
Document Type and Number:
Japanese Patent JP7461132
Kind Code:
B2
Abstract:
The present invention provides a cutting apparatus which does not damage a wafer and a cutting blade, and cutting water and chips are not sucked from between a mount and the cutting blade. The cutting apparatus of the present invention is provided with a control means (70). According to the control means (70), when a value measured by a pressure gauge (56) does not reach an allowable value, start of rotation of a rotary shaft (26) and start of supply of cutting water are prevented. On the other hand, when the value measured by the pressure gauge (56) reaches an allowable value, the start of the rotation of the rotary shaft (26) is permitted. At the same time, the start of the supply of the cutting water is permitted after the rotation of the rotary shaft (26) is started.
Inventors:
Hideji Nitta
Harunobu Yuzawa
Yoshio Matsushita
Harunobu Yuzawa
Yoshio Matsushita
Application Number:
JP2019214137A
Publication Date:
April 03, 2024
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B27/06; B23Q17/00; B24B45/00; B24B49/10; B28D1/24; B28D7/00; H01L21/301
Domestic Patent References:
| JP2015023139A | ||||
| JP2016111173A | ||||
| JP2018010952A | ||||
| JP2019104068A | ||||
| JP2015023222A |
Foreign References:
| US5934973 |
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
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