Title:
単結晶インゴットの切断方法
Document Type and Number:
Japanese Patent JP6572827
Kind Code:
B2
Inventors:
Koji Kitagawa
Application Number:
JP2016102963A
Publication Date:
September 11, 2019
Filing Date:
May 24, 2016
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/304; B24B5/50; B24B27/06; B28D5/04
Domestic Patent References:
JP11156849A | ||||
JP9262825A | ||||
JP2002283340A | ||||
JP10100142A | ||||
JP11048238A | ||||
JP2002018711A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi