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Patent Searching and Data


Title:
円筒研削方法及び円筒研削盤
Document Type and Number:
Japanese Patent JP6578772
Kind Code:
B2
Inventors:
Akira Watanabe
Application Number:
JP2015136378A
Publication Date:
September 25, 2019
Filing Date:
July 07, 2015
Export Citation:
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Assignee:
JTEKT Corporation
International Classes:
B24B49/04; B24B5/04
Domestic Patent References:
JP2047164U
JP4159077A
JP2003275957A
JP60003951B1
JP52002757B1
Attorney, Agent or Firm:
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji