Title:
MEMSマイクロフォンを有する素子、及び前記素子の製造方法
Document Type and Number:
Japanese Patent JP4981913
Kind Code:
B2
Abstract:
The component with a micro electromechanical system (MEMS) microphone has a housing for a chip with a hollow space with a sound entry opening closed from within by the chip. Surface mounted technology (SMT) contacts are at the under side of the housing. The MEMS chip is connected to the housing base by flip-flop bonding or an electrically conductive adhesive. The volume for the microphone function is extended in the hollow space to the side of the MEMS chip.
Inventors:
Paul, Wolfgang
Application Number:
JP2009529532A
Publication Date:
July 25, 2012
Filing Date:
September 27, 2007
Export Citation:
Assignee:
EPCOS AG
International Classes:
H04R31/00; H04R19/04
Domestic Patent References:
| JP2004072368A | ||||
| JP51131315A | ||||
| JP2149199A | ||||
| JP2006153804A |
Foreign References:
| WO2006023016A1 |
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Johei Nakamura
Takanori Mamoru
Taiji Morikawa
Johei Nakamura