Title:
A device, a printed circuit board, and an image forming device
Document Type and Number:
Japanese Patent JP6104189
Kind Code:
B2
Abstract:
The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.
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| WO/2009/003505 | A MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB |
Inventors:
Shinsuke Serizawa
Application Number:
JP2014015751A
Publication Date:
March 29, 2017
Filing Date:
January 30, 2014
Export Citation:
Assignee:
Canon Inc
International Classes:
H05K1/02; G03G15/00; G03G15/02; G03G15/08; G03G15/16; H01R12/71; H01R13/11; H05K1/11
Domestic Patent References:
| JP61078195A | ||||
| JP2005019506A | ||||
| JP2010103312A | ||||
| JP2002158408A |
Attorney, Agent or Firm:
Toshikazu Kaji
Hiroyuki Niwa
Eiko Nakamura
Hiroyuki Niwa
Eiko Nakamura