Title:
A disposal method of a wafer processor and a wafer
Document Type and Number:
Japanese Patent JP6277021
Kind Code:
B2
Inventors:
Minoru Suzuki
Application Number:
JP2014049333A
Publication Date:
February 07, 2018
Filing Date:
March 12, 2014
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; H01L21/301
Domestic Patent References:
JP2014022574A | ||||
JP10144632A | ||||
JP2005347675A | ||||
JP2005064151A | ||||
JP4212422A | ||||
JP2007194433A | ||||
JP2013141651A | ||||
JP2010123858A | ||||
JP2010205865A | ||||
JP2006310395A | ||||
JP9199460A |
Foreign References:
US20080182387 | ||||
WO2008142975A1 |
Attorney, Agent or Firm:
Hiroaki Sakai