Title:
A dressing device and a semiconductor manufacturing device
Document Type and Number:
Japanese Patent JP6250459
Kind Code:
B2
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Inventors:
Koji Maruyama
Ken Iizumi
Junji Kunizawa
Ken Iizumi
Junji Kunizawa
Application Number:
JP2014079982A
Publication Date:
December 20, 2017
Filing Date:
April 09, 2014
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B53/017; B24B53/02; H01L21/304
Domestic Patent References:
| JP2010172996A | ||||
| JP2009572A | ||||
| JP10086057A |
Foreign References:
| US20070212983 |
Attorney, Agent or Firm:
Seiji Ohno
Koji Morita
Shinji Kato
Mamoru Suzuki
Taeko Motohashi
Koji Morita
Shinji Kato
Mamoru Suzuki
Taeko Motohashi
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