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Title:
A drill provided with a covering section
Document Type and Number:
Japanese Patent JP6245576
Kind Code:
B2
Abstract:
The present invention relates to a method for coating a substrate, preferably a drill, wherein at least one first HiPIMS layer is applied by means of a HiPIMS process. Preferably, at least one second layer is applied to the first HiPIMS layer by means of a coating process that does not contain a HiPIMS process.

Inventors:
Krasnitzer, Siegfried
Application Number:
JP2014536137A
Publication Date:
December 13, 2017
Filing Date:
October 18, 2012
Export Citation:
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Assignee:
OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
International Classes:
B23B51/00; B23G5/06; C23C16/30
Domestic Patent References:
JP2010528179A
JP2011189419A
JP2005324306A
JP2004160561A
JP2007160506A
JP2007254777A
JP2009154287A
JP2014514452A
JP2014517870A
Foreign References:
US20110220415
Other References:
MUENZ W-D,JOURNAL OF PHYSICS: CONFERENCE SERIES,英国,INSTITUTE OF PHYSICS PUBLISHING,2008年 3月 1日,V 100 N PART.8,P1-6
HOVSEPIAN P EH,VACUUM,英国,PERGAMON PRESS,2008年 6月19日,V82 N11,P1312-1317
Attorney, Agent or Firm:
Fukami patent office



 
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