Title:
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016116033
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve a thicker film, and to suppress introduction of a damage into an acoustic wave element and the like.SOLUTION: A method for manufacturing an acoustic wave device includes the steps of: forming an electrode of an acoustic element on a substrate 10; forming a first mask layer 50 having a first opening 52 through which at least a part of the electrode is exposed on the substrate; coming into contact with the electrode in the first opening and forming a seed layer 16 on the substrate so as to cover the first mask layer; forming a second mask layer 54 having a second opening 56 overlapping the first opening on the seed layer; forming a plating layer 22 on the seed layer in the second opening by feeding power from the seed layer; and lifting off the seed layer other than the first opening by removing the first and second mask layers.SELECTED DRAWING: Figure 4
Inventors:
HATAYAMA KAZUE
Application Number:
JP2014252114A
Publication Date:
June 23, 2016
Filing Date:
December 12, 2014
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H03H3/08
Attorney, Agent or Firm:
Shuhei Katayama
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