An electroless plating method using electroless nickel Plating bath and this

Title:

An electroless plating method using electroless nickel Plating bath and this

Document Type and Number:

Japanese Patent JP6025899

Kind Code:

B2

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Inventors:

Katsunori Nomura
Yukinori Oda
Inagawa expansion
Toshiaki Shibata

Application Number:

JP2015068739A

Publication Date:

November 16, 2016

Filing Date:

March 30, 2015

Export Citation:

Assignee:

Uemura Industry Co., Ltd.

International Classes:

C23C18/34

Domestic Patent References:

JP2008274444A
JP2002180261A

Attorney, Agent or Firm:

Maeda patent office

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