電子回路装置

Japanese Patent JP7354004

B2

This electronic circuit device is provided with: a circuit board having a wiring layer formed thereon; a conductor electrically connected to the wiring layer; a flow path former forming, together with the circuit board, a flow path for a refrigerant that flows in contact with the circuit board; a fastening member for fastening the circuit board and the conductor together; and a seal member for tightly sealing the flow path. The circuit board has formed therein a first through-hole penetrating therethrough between a cooling surface on which the flow path is formed and a back surface opposite to the cooling surface. The conductor has formed therein a second through-hole communicating with the first through-hole. The fastening member fastens the circuit board and the conductor together through the first through-hole and the second through-hole. As the fastening member fastens the circuit board and the conductor together, the seal member closes the first through-hole and the flow path is tightly sealed.

JP2016047001	ELECTRIC VEHICLE
JP2006019477	COOLING STRUCTURE OF INTELLIGENT POWER MODULE
JPH0536877	BOARD HOLDER COOLING DEVICE

Masahiro Senoo
Takahiro Araki
Ken Tokuyama

JP2020020127A

October 02, 2023

February 07, 2020

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株式会社日立製作所

H01L23/473; H02M7/48; H05K7/20

JP2000349480A
JP2014228117A
JP2005282551A
JP11163572A
JP2014096910A
JP2013062334A
JP2002043488A

DE102016106180A1

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