Title:
ELECTRONIC COMPONENT PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2023030917
Kind Code:
A
Abstract:
To improve the reliability of an electronic component.SOLUTION: An electronic component processing device according to an aspect of the present disclosure comprises: a conveyance processing unit which includes a component holding unit which holds an electronic component, a support unit which supports the component holding unit in such a manner as to be located on a circular orbit which passes through a processing region in order to execute predetermined processing for the electronic component, a rotation drive unit which rotates the support unit around the central axis of the circular orbit, and a displacement drive unit which displaces the component holding unit in the processing region; a load detection unit which detects a load imposed on the electronic component when the displacement drive unit displaces the component holding unit in the processing region; and a controller which detects a contact abnormality in the electronic component based on the change of detection values from the load detection unit from a first timing to a second timing when the component holding unit is displaced.SELECTED DRAWING: Figure 2
Inventors:
YODOGAWA SUMIMASA
Application Number:
JP2021136339A
Publication Date:
March 08, 2023
Filing Date:
August 24, 2021
Export Citation:
Assignee:
UENO SEIKI KK
International Classes:
H01L21/677; B25J13/08; B25J19/06; B65B57/00; H01L21/301
Domestic Patent References:
| JP2009136950A | 2009-06-25 | |||
| JP2012148807A | 2012-08-09 | |||
| JP2018092428A | 2018-06-14 |
Foreign References:
| WO2015151896A1 | 2015-10-08 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yasunori Ishizaka
Shigeki Matsuo
Mao Nakamura
Yasunori Ishizaka
Shigeki Matsuo
Mao Nakamura
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