Title:
電子部品
Document Type and Number:
Japanese Patent JP7427966
Kind Code:
B2
Abstract:
Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.
Inventors:
Kazuhiro Yoshikawa
Kenichi Yoshida
Takashi Otsuka
Yuichiro Okuyama
Takeshi Ohashi
Hajime Kuwashima
Kenichi Yoshida
Takashi Otsuka
Yuichiro Okuyama
Takeshi Ohashi
Hajime Kuwashima
Application Number:
JP2020004870A
Publication Date:
February 06, 2024
Filing Date:
January 16, 2020
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H01F17/00; H01G4/40; H01F27/00; H01F27/08; H01F41/04; H01G2/08; H01G2/10; H01G4/30; H01G17/00; H03H5/02
Domestic Patent References:
| JP2019125707A | ||||
| JP2021111701A |
Foreign References:
| WO2008018227A1 | ||||
| WO2017134761A1 | ||||
| US20110075317 |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese