Title:
電子制御装置
Document Type and Number:
Japanese Patent JP7280208
Kind Code:
B2
Abstract:
An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.
Inventors:
Minami Teranishi
Kawakita Shinya
Hideyuki Sakamoto
Kawakita Shinya
Hideyuki Sakamoto
Application Number:
JP2020008785A
Publication Date:
May 23, 2023
Filing Date:
January 22, 2020
Export Citation:
Assignee:
Hitachi Astemo, Ltd.
International Classes:
H05K9/00; G06F1/16; G06F1/20; H01L23/00; H01L23/06; H01L23/34; H01L23/36; H05K7/20
Foreign References:
| WO2016163135A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Sunnext International Patent Office