Title:
An electronic devide, electronic equipment, a manufacturing method of a base board, and a manufacturing method of an electronic devide
Document Type and Number:
Japanese Patent JP6119108
Kind Code:
B2
Abstract:
An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.
Inventors:
Yukihiro Hashi
Application Number:
JP2012089664A
Publication Date:
April 26, 2017
Filing Date:
April 10, 2012
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H9/02; H01L23/02; H03H3/02
Domestic Patent References:
| JP2009010717A | ||||
| JP2000134055A | ||||
| JP2011147054A | ||||
| JP11354660A | ||||
| JP2002100694A | ||||
| JP2006080380A | ||||
| JP2012009967A | ||||
| JP2012015779A | ||||
| JP2004289470A | ||||
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| JP2005216932A | ||||
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Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi