An electronic packaging system, an electronic parts mounting device, and an electronic component mounting method

Title:

An electronic packaging system, an electronic parts mounting device, and an electronic component mounting method

Document Type and Number:

Japanese Patent JP5990775

Kind Code:

B2

Inventors:

Tomomatsu Michinori
Masanori Ikeda
Yosaku

Application Number:

JP2012182916A

Publication Date:

September 14, 2016

Filing Date:

August 22, 2012

Export Citation:

Assignee:

Panasonic IP Management Co., Ltd.

International Classes:

H05K13/04; H05K3/34

Domestic Patent References:

Attorney, Agent or Firm:

Kenji Kamada
Hiroo Maeda

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