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Title:
An electronic parts mounting device and an electronic component mounting method
Document Type and Number:
Japanese Patent JP6019409
Kind Code:
B2
Abstract:
Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

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Inventors:
Hideaki Watanabe
Sei Imai
Shigeki Imafuku
Toshiyuki Koyama
Application Number:
JP2013234697A
Publication Date:
November 02, 2016
Filing Date:
November 13, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/08; H05K13/04
Domestic Patent References:
JP58075014A
JP62061393A
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda



 
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