Title:
ELECTRONIC COMPONENT PACKAGE FOR ELECTROMAGNETIC INTERFERENCE SHIELDING AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2018078263
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component package for electromagnetic interference shielding, capable of preventing or reducing harmful influence on other electronic components mounted in adjacent places by absorbing electromagnetic waves in a magnetic layer, the electromagnetic waves being generated from electronic components embedded in a molding member, and also capable of protecting electronic components embedded in the molding member from electromagnetic wave influence by shielding electromagnetic waves coming from the outside due to the conductive layer formed on the magnetic layer.SOLUTION: An electronic component package for electromagnetic interference shielding includes: a substrate where electronic components are mounted; a molding member formed on the substrate and the electronic components; a magnetic layer formed on the molding member; and a conductive layer formed on the magnetic layer.SELECTED DRAWING: Figure 1
Inventors:
JEONG SE-YOUNG
JOO KI SU
LEE JU YOUNG
HWANG JEONG WOO
YOON JIN HO
JOO KI SU
LEE JU YOUNG
HWANG JEONG WOO
YOON JIN HO
Application Number:
JP2016237576A
Publication Date:
May 17, 2018
Filing Date:
December 07, 2016
Export Citation:
Assignee:
NTRIUM INC
International Classes:
H01L23/00; H01L23/28; H01L23/29; H01L23/31; H05K1/02; H05K3/28; H05K9/00
Domestic Patent References:
| JP5988003B1 | 2016-09-07 | |||
| JP2015043357A | 2015-03-05 | |||
| JP2005079139A | 2005-03-24 | |||
| JP5892282B1 | 2016-03-23 |
Foreign References:
| WO2015157987A1 | 2015-10-22 | |||
| WO2016002780A1 | 2016-01-07 |
Attorney, Agent or Firm:
IPD International Patent Business Corporation