Title:
An embedding board, a printing circuit board, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5989814
Kind Code:
B2
Abstract:
An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.
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Inventors:
Kim, san hun
Min, Tae Hoon
Ko, Young Guan
Kim, hee
Cho, Suk Hyun
Gwang, Chiru
Lee Han
Min, Tae Hoon
Ko, Young Guan
Kim, hee
Cho, Suk Hyun
Gwang, Chiru
Lee Han
Application Number:
JP2015005368A
Publication Date:
September 07, 2016
Filing Date:
January 14, 2015
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2011216740A | ||||
| JP62130595A |
Attorney, Agent or Firm:
Ippei Watanabe
Hiroyuki Sato
Shigeru Koike
Hiroyuki Sato
Shigeru Koike