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Title:
An embedding board, a printing circuit board, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5989814
Kind Code:
B2
Abstract:
An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.

Inventors:
キム,サン フン
ミン,テ ホン
コ,ヨン グァン
キム,ヘ ジン
チョ,ソク ヒョン
グァン,チル ウ
リ,ジョン ハン
Application Number:
JP2015005368A
Publication Date:
September 07, 2016
Filing Date:
January 14, 2015
Export Citation:
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Assignee:
サムソン エレクトロ−メカニックス カンパニーリミテッド.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
JP2011216740A
JP62130595A
Attorney, Agent or Firm:
渡邉 一平
佐藤 博幸
小池 成



 
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