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Title:
The epoxy compound which has an alkoxy silyl group, its manufacturing method, the constituent and hardened material containing it, and its use
Document Type and Number:
Japanese Patent JP6153631
Kind Code:
B2
Abstract:
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

Inventors:
Chun, Hyun-D
Park, Son-fan
Kim, Yoon Joo
Park, Soo Jin
Park Soo Kyung
Taku, San-Young
Application Number:
JP2015559194A
Publication Date:
June 28, 2017
Filing Date:
February 25, 2014
Export Citation:
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Assignee:
Korea Institute of Industrial Technology
International Classes:
C07F7/18; C08G59/02; C08G59/14; C08K3/00; C08K7/02; C08L63/00; C09D7/12; C09D163/00; C09J11/04; C09J163/00; H01L23/14; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
JP2005281528A
JP2009275015A
JP2012129010A
JP10045871A
JP57016446A
Other References:
小椋 一郎,エポキシ樹脂の化学構造と特性の関係,DIC Technical Review,2001年,No.7,1-12
小椋 一郎,常識破りの最新鋭エポキシ樹脂,DIC Technical Review,2005年,No.11,21-28
第4版実験化学講座,丸善株式会社,1992年,高分子合成,431-438
Attorney, Agent or Firm:
Hanabusa Patent and Trademark Office