Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023070208
Kind Code:
A
Abstract:
To provide an epoxy resin composition which provides a cured product having excellent heat resistance and moisture resistance and is excellent in low-temperature curability and short time curing and generates less volatile components during curing.SOLUTION: There is provided an epoxy resin composition which comprises the following components (A) to (E): (A) 100 pts. mass of an epoxy resin having two or more epoxy groups in one molecule which is not modified with a silicone, (B) a thiol compound having 3 or more thiol groups in one molecule, (C) 0.5 to 100 pts. mass of a silicone-modified epoxy resin, (D) 1.0 to 200 pts. mass of a microcapsule type curing accelerator and (E) 0.05 to 10 pts. mass of a reaction inhibitor, wherein the amount of the component (B) is an amount such that the molar equivalent ratio of the thiol group in the component (B) is 0.1 to 1.0 to the total molar equivalent amount of epoxy groups in the component (A) and the component (C).SELECTED DRAWING: None
Inventors:
KUSHIHARA NAOYUKI
SUMIDA KAZUMASA
YAJIMA AKIRA
SUMIDA KAZUMASA
YAJIMA AKIRA
Application Number:
JP2021182227A
Publication Date:
May 19, 2023
Filing Date:
November 09, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/20; C08G59/66
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office
Previous Patent: Image recognition device, image recognition system, and image recognition method
Next Patent: disaster prevention system
Next Patent: disaster prevention system