Title:
An epoxy resin, a hardening resin constituent, its hardened material, and the charge of an IC package
Document Type and Number:
Japanese Patent JP6065215
Kind Code:
B2
Inventors:
Yousuke Hirota
Application Number:
JP2013043983A
Publication Date:
January 25, 2017
Filing Date:
March 06, 2013
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/06; C08G14/12; C08G59/32; C08G61/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP2014122277A | ||||
| JP745557B2 | ||||
| JP5393B2 |
Attorney, Agent or Firm:
Kono Tsuyo