Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
充填装置
Document Type and Number:
Japanese Patent JP7163081
Kind Code:
B2
Abstract:
Provided is a filling apparatus including: a conveyor line configured to intermittently convey spout-equipped bags, which are suspended so that spouts protruding from one side of the spout-equipped bags, the bags being flat, are located on an upper side and the bags are located on a lower side, in a width direction of the suspended spout-equipped bags on a movement straight line; a printing apparatus disposed in the middle of the conveyor line and configured to print manufacturing information on the suspended spout-equipped bags; and nozzles configured to fill the suspended spout-equipped bags with a liquid material through the spouts. The conveyor line is further configured to convey the spout-equipped bags so that fronts of the spout-equipped bags directly face the printing apparatus.

Inventors:
Shinichi Hiramoto
Hiroyuki Miyoshi
Application Number:
JP2018122254A
Publication Date:
October 31, 2022
Filing Date:
June 27, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hosokawa Yoko Co., Ltd.
International Classes:
B65B3/02; B65B3/28; B67B3/20
Domestic Patent References:
JP2001328601A
JP2016064867A
JP11314602A
JP2002536265A
JP2015509469A
JP2002002945A
JP2017006826A
JP2016175725A
JP4082734A
Foreign References:
US6430896
US20080313998
US8079200
US20100170591
US4630654
Attorney, Agent or Firm:
Katsuhisa Kuma



 
Previous Patent: optical encoder

Next Patent: MOLD MOTOR