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Title:
The fixing solution constituent and primer constituent for metal plastic hybrid members
Document Type and Number:
Japanese Patent JP6223473
Kind Code:
B2
Abstract:
The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Inventors:
Villi Henken Johann
Karl Kuman
Maximilian Greene
Andreas Pavlik
Martin list house
Claus Versh
Sven Mang
Application Number:
JP2015555688A
Publication Date:
November 01, 2017
Filing Date:
January 29, 2014
Export Citation:
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Assignee:
Evonik Degussa GmbH
SI-Coatings GmbH
International Classes:
C09D5/00; C09D161/04; C09D163/00; C09D177/00; C09J167/00; C09J177/00
Domestic Patent References:
JP55071772A
JP55147580A
JP2006117824A
JP2006057043A
JP2011195840A
JP2007190917A
JP2012528211A
JP2012502153A
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno