Title:
A formation method of an aluminide coat to a substrate top
Document Type and Number:
Japanese Patent JP6050888
Kind Code:
B2
Abstract:
There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere.
Inventors:
Hiro Nakano
Yoshinori Negishi
Haruo Akahoshi
Takeshi Izumi
Keiko Kojima
Hideyuki Arikawa
Yoshinori Negishi
Haruo Akahoshi
Takeshi Izumi
Keiko Kojima
Hideyuki Arikawa
Application Number:
JP2015504064A
Publication Date:
December 21, 2016
Filing Date:
March 07, 2013
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
C23C10/28; C23C10/04; C25D3/66; C25D5/38; C25D21/11; F01D5/28; F01D25/00; F02C7/00; F23R3/42
Domestic Patent References:
| JP2008138224A | 2008-06-19 | |||
| JPH0328391A | 1991-02-06 | |||
| JPH0328392A | 1991-02-06 | |||
| JPH03134193A | 1991-06-07 | |||
| JPS55115994A | 1980-09-06 |
Foreign References:
| WO2006077670A1 | 2006-07-27 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
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